The future of RTP, a technology that can change the IC fab industry.
Autor: | Mattson, B., Timans, P., Sing-Pin Tay, Devine, D.J., Jung Kim |
---|---|
Zdroj: | 9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001; 2001, p13-27, 15p |
Databáze: | Complementary Index |
Externí odkaz: |