A novel tool for cure dependent viscoelastic characterization of packaging polymers.
| Autor: | van 't Hof, C., Wisse, G., Ernst, L.J., Jansen, K.M.B., Yang, D.G., Zhang, G.Q., Bressers, H.J.L. |
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| Zdroj: | Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004; 2004, p385-390, 6p |
| Databáze: | Complementary Index |
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