Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration.
| Autor: | Sundaram, V., Tummala, R., Wiedenman, B., Liu, F., Markondeya Raj, P., Abothu, I.R., Bhattacharya, S., Varadarajan, M., Bongio, E., Sherwood, W. |
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| Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p6-6, 1p |
| Databáze: | Complementary Index |
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