The impact of interfacial void formation on Pb-free Sn-4.0Ag-0.5Cu BGA solder joint integrity.
| Autor: | Cavasin, D. |
|---|---|
| Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p5-5, 1p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Cavasin, D. |
|---|---|
| Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p5-5, 1p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|