Designing for 1/sup st/ and 2/sup nd/ level reliability of micro-electronic packages using combined experimental - numerical techniques.
Autor: | van Silfhout, R.B.R., Jansen, M.Y., van Driel, W.D., Zhang, G.Q. |
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Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p7-7, 1p |
Databáze: | Complementary Index |
Externí odkaz: |