Designing for 1/sup st/ and 2/sup nd/ level reliability of micro-electronic packages using combined experimental - numerical techniques.

Autor: van Silfhout, R.B.R., Jansen, M.Y., van Driel, W.D., Zhang, G.Q.
Zdroj: 56th Electronic Components & Technology Conference 2006; 2006, p7-7, 1p
Databáze: Complementary Index