An innovative chip-to-wafer and wafer-to-wafer stacking.
| Autor: | Wei-Chung Lo, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Ying-Ching Shih, Su-Tsai Lu |
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| Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p6-6, 1p |
| Databáze: | Complementary Index |
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