Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP.
| Autor: | Cheng-Ta Ko, Shoulung Chen, Chia-Wen Chiang, Tzu-Ying Kuo, Ying-Ching Shih, Yu-Hua Chen |
|---|---|
| Zdroj: | 56th Electronic Components & Technology Conference 2006; 2006, p8-8, 1p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|