Adhesion improvement of thermoplastic conductive adhesives under humid environment.
| Autor: | Moon, K., Rockett, C., Kretz, C., Burgoyne, W.F., Wong, C.P. |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1791-1799, 9p |
| Databáze: | Complementary Index |
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