Effect of void in the anisotropic conductive assembly.
| Autor: | Yeung, N.H., Chan, Y.C., Tan, S.C., Lee, K.K., Chan, K.K. |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1378-1382, 5p |
| Databáze: | Complementary Index |
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