Assembly challenges related to fine pitch in-line and staggered bond pad devices.
| Autor: | Ruston, M., Tu Anh Tran, Yong, L., Youngblood, A., Ravenscraft, D., Harun, F., Kok Wai Mui |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1334-1343, 10p |
| Databáze: | Complementary Index |
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