Lead-free molded underfill technology for exposed die flip chip packages assembled in a molded matrix array packages form.
| Autor: | Choong Kooi Chee, Szu Shing Lim, Rudge, V.A., Periaman, S., Ai Lin Ong, Hwa Wei Chan, Then, E. |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p962-970, 9p |
| Databáze: | Complementary Index |
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