A novel defect detection technique using active transient thermography for high density package and interconnections.
| Autor: | Chai, T.C., Wongi, B.S., Bai, W.M., Trigg, A., Lain, Y.K. |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p920-925, 6p |
| Databáze: | Complementary Index |
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