Bumpless flip chip packages for cost/performance driven devices.
| Autor: | Lin, C.W.C., Chiang, S.C.L., Yang, T.K.A. |
|---|---|
| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p554-559, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|