Large die flip chip packaging on organic substrates. the role of finite element analysis (FEA), materials characterization, failure analysis (FA) and test vehicles in development spins.
| Autor: | Goodelle, J.P., Amin, A., Gilbert, J., Horvath, C., Nease, E., Vaccaro, B.T. |
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| Zdroj: | Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p524-535, 12p |
| Databáze: | Complementary Index |
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