Extracting CAD models for quantifying noise coupling between vias in PCB layouts.
| Autor: | Luan, S., Fan, J., Liu, W., Xiao, F., Knighten, J., Smith, N., Alexander, R., Nadolny, J., Kami, Y., Drewniak, J. |
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| Zdroj: | 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p343-346, 4p |
| Databáze: | Complementary Index |
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