Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI.
| Autor: | Sunohara, M., Fujii, T., Hoshino, M., Yonemura, H., Tomisaka, M., Takahashi, K. |
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| Zdroj: | 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p238-245, 8p |
| Databáze: | Complementary Index |
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