Using of solderable conductive pastes in PCB prototyping.

Autor: Marin, A., Svasta, P., Ionescu, C., Codreanu, N.-D.
Zdroj: 2nd International IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599); 2002, p17-21, 5p
Databáze: Complementary Index