Using of solderable conductive pastes in PCB prototyping.
Autor: | Marin, A., Svasta, P., Ionescu, C., Codreanu, N.-D. |
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Zdroj: | 2nd International IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599); 2002, p17-21, 5p |
Databáze: | Complementary Index |
Externí odkaz: |