Thermal shock reliability tests of multilayer LTCC modules with thick film conductors.
| Autor: | Pietrikova, A., Bansky, J., Bujalobokova, M., Urbancik, J. |
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| Zdroj: | 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003; 2003, p485-488, 4p |
| Databáze: | Complementary Index |
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