Effects of N doping in Ru-Ta alloy barrier on film property and reliability for Cu interconnects.
| Autor: | Torazawa, N., Hinomura, T., Mori, K., Koyama, Y., Hirao, S., Kobori, E., Korogi, H., Maekawa, K., Tomita, K., Chibahara, H., Suzumura, N., Asai, K., Miyatake, H., Matsumoto, S. |
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| Zdroj: | 2009 IEEE International Interconnect Technology Conference; 2009, p113-115, 3p |
| Databáze: | Complementary Index |
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