Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions.
| Autor: | Ahmad, M., Weidong Xie, Kuo-Chuan Liu, Jie Xue, Towne, D. |
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| Zdroj: | 2009 59th Electronic Components & Technology Conference; 2009, p682-691, 10p |
| Databáze: | Complementary Index |
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