A solder joint fatigue life model for combined vibration and temperature environments.
| Autor: | Eckert, T., Muller, W.H., Nissen, N.F., Reichl, H. |
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| Zdroj: | 2009 59th Electronic Components & Technology Conference; 2009, p522-528, 7p |
| Databáze: | Complementary Index |
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