Indium solder as a thermal interface material using fluxless bonding technology.
| Autor: | Chaowasakoo, T., Teng Hoon Ng, Songninluck, J., Stern, M.B., Ankireddi, S. |
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| Zdroj: | 2009 25th Annual IEEE Semiconductor Thermal Measurement & Management Symposium; 2009, p180-185, 6p |
| Databáze: | Complementary Index |
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