Copper direct bonding for 3D integration.
| Autor: | Gueguen, Pierric, di Cioccio, Lea, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent |
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| Zdroj: | 2008 International Interconnect Technology Conference; 2008, p61-63, 3p |
| Databáze: | Complementary Index |
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