3D electromagnetic chip package simulation for high-speed serial interface application.
| Autor: | Rydygier, A., Kakerow, R., Munteanu, I., Buchmann, M., Muller, M. |
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| Zdroj: | 2008 International Conference on Signals & Electronic Systems; 2008, p61-64, 4p |
| Databáze: | Complementary Index |
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