Low cost through silicon via solution suitable compatible with existing assembly infrastructure and suitable for single die and die stacked packages.
| Autor: | Humpston, G., Kidron, B., Kriman, M. |
|---|---|
| Zdroj: | 2008 International Conference on Electronic Materials & Packaging; 2008, p61-64, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|