A Low-Power Sensor Design, SJ Monitor, for Monitoring 24x7 the Health of BGA Solder Joints.
| Autor: | Hofmeister, J.P., Judkins, J.B., Goodman, D., Tracy, T.A., Roth, N.N. |
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| Zdroj: | 2008 IEEE Aerospace Conference; 2008, p1-9, 9p |
| Databáze: | Complementary Index |
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