Application of through mold via (TMV) as PoP base package.
| Autor: | Jinseong Kim, Kiwook Lee, Dongjoo Park, Taekyung Hwang, Kwangho Kim, Daebyoung Kang, Jaedong Kim, Choonheung Lee, Scanlan, C., Berry, C.J., Zwenger, C., Smith, L., Dreiza, M., Darveaux, R. |
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| Zdroj: | 2008 58th Electronic Components & Technology Conference; 2008, p1089-1092, 4p |
| Databáze: | Complementary Index |
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