A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test.
| Autor: | Yi-Shao Lai, Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L. |
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| Zdroj: | 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2008, p57-62, 6p |
| Databáze: | Complementary Index |
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