Lid adhesive failure study for flip chip packaging.
| Autor: | Ong, M.C., Zhao, X.L., Joman, P.P., Chin, J.M., Master, R.N. |
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| Zdroj: | 2008 15th International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2008, p1-4, 4p |
| Databáze: | Complementary Index |
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