3D fracture mechanics analysis of underfill delamination for flip chip packages.
| Autor: | Zhen Zhang, Zhai, C.J., Master, R.N. |
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| Zdroj: | 2008 11th Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems; 2008, p751-755, 5p |
| Databáze: | Complementary Index |
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