Parametric thermal modeling of heat transfer in handheld electronic devices.
| Autor: | Jaeho Lee, Gerlach, D.W., Joshi, Y.K. |
|---|---|
| Zdroj: | 2008 11th Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems; 2008, p604-609, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|