High Density PoP (Package-on-Package) and Package Stacking Development.
| Autor: | Dreiza, M., Yoshida, A., Ishibashi, K., Maeda, T. |
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| Zdroj: | 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p1397-1402, 6p |
| Databáze: | Complementary Index |
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