Wafer Level Thin Film Encapsulation for BAW RF MEMS.

Autor: Pornin, J.L., Gillot, C., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Dumont, F.
Zdroj: 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p605-609, 5p
Databáze: Complementary Index