Wafer Level Thin Film Encapsulation for BAW RF MEMS.
Autor: | Pornin, J.L., Gillot, C., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Dumont, F. |
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Zdroj: | 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p605-609, 5p |
Databáze: | Complementary Index |
Externí odkaz: |