3D Multi Scale Modeling of Wire Bonding Induced Peeling in Cu/Low-k Interconnects: Application of an Energy Based Criteria and Correlations with Experiments.
| Autor: | Fiori, V., Lau Teck Beng, Downey, S., Gallois-Garreignot, S., Orain, S. |
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| Zdroj: | 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p256-263, 8p |
| Databáze: | Complementary Index |
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