A study of self-assembled monolayer coating for non-stick encapsulation mold.
| Autor: | Ya-Yu Hsieh, Hung-Ta Hsu, Lin, M.T., Yi-Shao Lai, Shu-Hui Chen |
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| Zdroj: | 2007 International Microsystems, Packaging, Assembly & Circuits Technology; 2007, p181-183, 3p |
| Databáze: | Complementary Index |
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