Gold Wire Bonding Induced Peeling in Cu/Low-k Interconnects: 3D Simulation and Correlations.
| Autor: | Fiori, V., Lau Teck Beng, Downey, S., Gallois-Garreignot, S., Orain, S. |
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| Zdroj: | 2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation Experiments in Microelectronics & Micro-Systems. EuroSime 2007; 2007, p1-9, 9p |
| Databáze: | Complementary Index |
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