Local distribution of residual strain in 3-D stacked flip chips measured by strain sensor chips with 2-μm long piezoresistive gauges.
| Autor: | Sasaki, T., Ueta, N., Miura, H. |
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| Zdroj: | 2007 International Conference on Electronic Materials & Packaging; 2007, p1-6, 6p |
| Databáze: | Complementary Index |
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