Challenges for 3D IC integration: bonding quality and thermal management.
| Autor: | Leduca, P., de Crecy, F., Fayolle, M., Charlet, B., Enot, T., Zussy, M., Jones, B., Barbe, J.-C., Kernevez, N., Sillon, N., Maitrejean, S., Louisa, D. |
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| Zdroj: | 2007 IEEE International Interconnect Technology Conference; 2007, p210-212, 3p |
| Databáze: | Complementary Index |
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