Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask.
| Autor: | Daamen, R., Bancken, P.H.L., Emur Badaroglu, D., Michelon, J., Nguyen, V.H., Verheijden, G.J.A.M., Humbert, A., Waeterloos, J., Yang, A., Cheng, J.K., Chen, L., Martens, T., Hoofman, R.J.O.M. |
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| Zdroj: | 2007 IEEE International Interconnect Technology Conference; 2007, p61-63, 3p |
| Databáze: | Complementary Index |
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