Reliability of Adhesive Attachments on Thick Film Hybrid Substrate.
| Autor: | Kiilunen, J., Kuusiluoma, S., Heino, P. |
|---|---|
| Zdroj: | 2007 9th Electronics Packaging Technology Conference; 2007, p764-769, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Kiilunen, J., Kuusiluoma, S., Heino, P. |
|---|---|
| Zdroj: | 2007 9th Electronics Packaging Technology Conference; 2007, p764-769, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|