Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets.
| Autor: | Gerty, D., Gerlach, D.W., Joshi, Y.K., Glezer, A. |
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| Zdroj: | 2007 13th International Workshop on Thermal Investigation of ICs & Systems (THERMINIC); 2007, p156-161, 6p |
| Databáze: | Complementary Index |
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