Study of Dynamic Warpage of Flip Chip Packages under Temperature Reflow.
| Autor: | Chee Kan Lee, Wei Keat Loh, Kang Eu Ong, Chin, I. |
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| Zdroj: | 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium; 2006, p185-190, 6p |
| Databáze: | Complementary Index |
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