M3-Modular Multi-Scale Assembly System for MEMS Packaging.
| Autor: | Popa, D., Murthy, R., Mitta, M., Jeongsik Sin, Stephanou, H. |
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| Zdroj: | 2006 IEEE/RSJ International Conference on Intelligent Robots & Systems; 2006, p3712-3717, 6p |
| Databáze: | Complementary Index |
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