Integrated ODP metrology as an APC enabler for complex high aspect ratio 3D deep trench device structures.
| Autor: | Schmidt, B., Reinig, P., Komarov, S., Hetzer, D., Likhachev, D., Funk, M. |
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| Zdroj: | 2006 IEEE International Symposium on Semiconductor Manufacturing; 2006, p339-342, 4p |
| Databáze: | Complementary Index |
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