Reliability Characterization of Different Pore Sealing Techniques on Porous Silk Dielectric Films.

Autor: Michelon, J., Waeterloos, J., Bancken, P.H.L., Nguyen, V.H., Caluwaerts, R., Beyer, G., Rozeveld, S., Beach, E., Hoofman, R.J.O.M.
Zdroj: 2006 IEEE International Reliability Physics Symposium Proceedings; 2006, p496-501, 6p
Databáze: Complementary Index