Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation.
| Autor: | Ernst, L.J., Jansen, K.M.B., Saraswat, M., van 't Hof, C., Zhang, G.Q., Yang, D.G., Bressers, H.J.L. |
|---|---|
| Zdroj: | 2006 7th International Conference on Electronic Packaging Technology; 2006, p1-7, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|