Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package.
| Autor: | Hsiang-Chen Hsu, Shen-Wen Yu, Yu-Teng Hsu, Wei-Yaw Chang, Ming-Jer Lin, Ruei-Ming Lin, Pei-Chieh Chin, Hung-Chun Ho, Ming-Cheng Lu, Cheng-Tung Lee, Chin-Liang Chen, Chien-Hung Liao, Yu-Jung Huang, Shen-Li Fu, Li-Shan Chen |
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| Zdroj: | 2006 7th International Conference on Electronic Packaging Technology; 2006, p1-6, 6p |
| Databáze: | Complementary Index |
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