Influence of process parameters and bump geometry on the residual stress distribution in a chip-on-foil bonding process.
| Autor: | Suter, P., Bauknecht, R., Graf, T., Duran, H., Venter, I. |
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| Zdroj: | 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings 43rd Annual; 2005, p513-517, 5p |
| Databáze: | Complementary Index |
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