Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low K technologies.
| Autor: | Human Wu, Archer, V., Merchant, S.M., Cargo, J., Chesire, D., Antol, J., Mengel, R., Osenbach, J., Horvat, S., Peridier, C., White, M. |
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| Zdroj: | 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings 43rd Annual; 2005, p286-293, 8p |
| Databáze: | Complementary Index |
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